Dataman BU-64863RC-E02

表面安装

YES

终端数量

324

Manufacturer Part Number

BU-64863RC-E02

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

DATA DEVICE CORP

Package Description

BGA, BGA324,18X18,40

Risk Rank

5.77

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA324,18X18,40

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Nom

3.3 V

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B324

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553