Device Engineering Incorporated DEI1072A-SES-G

表面安装

YES

Contact plating

gold-plated

Number of pins

22

终端数量

8

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

DEVICE ENGINEERING INC

Part Package Code

SOIC

Package Description

HLSOP,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HLSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Supply Voltage-Max

16.5 V

Supply Voltage-Min

9.5 V

Supply Voltage-Nom

15 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x11

Row pitch

2.54mm

Gross weight

1.18 g

Operating temperature

-40...163°C

JESD-609代码

e4

无铅代码

有

ECCN 代码

EAR99

端子表面处理

镍钯金

性别

ARINC 429

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

Current rating

1.5A

引脚数量

8

JESD-30代码

R-PDSO-G8

资历状况

不合格

温度等级

OTHER

座位高度-最大

1.55 mm

差分输出

YES

输入特性

DIFFERENTIAL

接口IC类型

LINE DRIVER

驱动程序位数

1

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

4.9 mm

宽度

3.89 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0