Device Engineering Incorporated DEI1282-SMS-G

表面安装

YES

Contact plating

gold-plated

Number of pins

40

终端数量

16

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

DEVICE ENGINEERING INC

Part Package Code

SOIC

Package Description

HSOP,

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG

Supply Voltage-Max

3.465 V

Supply Voltage-Min

3.135 V

Supply Voltage-Nom

3.3 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x20

Row pitch

2.54mm

Gross weight

2.4 g

Operating temperature

-40...163°C

JESD-609代码

e3

无铅代码

有

端子表面处理

哑光锡

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

40

引脚数量

16

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

MILITARY

座位高度-最大

1.75 mm

接口IC类型

电路接口

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

9.9 mm

宽度

3.91 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0