Dynex Semiconductor SP8690A

表面安装

NO

材料

synthetic polyolefin

终端数量

16

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GEC PLESSEY SEMICONDUCTORS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Diameter of protected wire (cable)

12.8…24 mm

Diameter before shrink

26.0 mm

Diameter after shrink

12.5 mm

Wall thickness before shrink

0.55 mm

Wall thickness after shrink

0.9 mm

Gross weight

1725.00

Transport packaging size/quantity

46*46*24/10

包装

coil 50 m

JESD-609代码

e0

类型

Heat shrink tube without adhesive

端子表面处理

Tin/Lead (Sn/Pb)

颜色

blue

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

温度等级

MILITARY

Operating temperature range

-55…+125 °C

逻辑IC类型

PRESCALER

电源电流-最大值(ICC)

21 mA

Shrink temperature

+70…+120 °C

最大频率@Nom-Sup

200000000 Hz

Operating voltage

600 V

收缩率

2:1