Essentra Components LS55
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LS55
806-LS55
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LS55 datasheet pdf and Integrated Circuits (ICs) product details from Essentra Components stock available at utmel
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LS55详情
Essentra Components LS55重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
二极管元件材料
SILICON
终端数量
2
Manufacturer Part Number
LS55
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NEC ELECTRONICS AMERICA INC
Package Description
GLASS PACKAGE-2
Risk Rank
5.84
Forward Voltage-Max (VF)
1 V
Number of Elements
1
Operating Temperature-Max
175 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
长式
Power Dissipation (Max)
0.5 W
端子位置
END
终端形式
环绕
Reach合规守则
unknown
JESD-30代码
O-LELF-R2
资历状况
不合格
配置
SINGLE
二极管类型
接收电极
箱体转运
ISOLATED
输出电流-最大值
0.1 A
最大非代表Pk前进电流
2 A
反向电流-最大值
0.1 µA
反向恢复时间-最大值
0.1 µs
LS55拓展信息
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