Freescale XPC823ZT75B2

表面安装

YES

终端数量

256

Package Description

BGA, BGA256,16X16,50

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA256,16X16,50

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

XPC823ZT75B2

Package Code

BGA

Package Shape

SQUARE

Manufacturer

摩托罗拉半导体产品

Part Life Cycle Code

Transferred

Ihs Manufacturer

MOTOROLA INC

Risk Rank

5.78

子类别

Microprocessors

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B256

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

速度

75 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32