Freescale Semiconductor BSS63

表面安装

YES

Housing material

GF - Nilon-66 (UL94V-0)

外壳材料

1

Dielectric strength

1500 (50 Hz, 1 min.) V

Gross weight

3.53

Transport packaging size/quantity

50*50*59/7000

Mounting method

cable mounting

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

,

Operating Temperature-Max

150 °C

JESD-609代码

e0

ECCN 代码

EAR99

Connector type

Low-voltage power connector Mini-Fit type (plug)

端子表面处理

Tin/Lead (Sn/Pb)

深度

24 mm

Reach合规守则

unknown

Number of contacts

6 (2x3)

Contact resistance

≤10 mΩ

配置

SINGLE

Insulation resistance

≥1000 MΩ

极性/通道类型

PNP

Operating temperature range

-25…+85 °C

最大耗散功率(Abs)

0.225 W

集电极电流-最大值(IC)

0.1 A

最小直流增益（hFE）

30

高度

11.7 mm

宽度

13.8 (housing) mm