Freescale Semiconductor MC68705R3P

表面安装

NO

材料

synthetic polyolefin

终端数量

40

捆绑中心至安装中心

3776

Wall thickness after shrinkage

0.9 mm

Shrinkage temperature

+70...+120 °C

Gross weight

1780.00

Transport packaging size/quantity

46*46*28/10

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP40,.6

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP40,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

5.25 V

Diameter of the protected wire (cable)

14.4...29 mm

Diameter before shrinkage

29.0 mm

Diameter after shrinkage

14.0 mm

Wall thickness before shrinkage

0.55 mm

包装

coil 50 m

JESD-609代码

e0

类型

Heat shrink tube without adhesive layer

端子表面处理

Tin/Lead (Sn/Pb)

颜色

black

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T40

资历状况

不合格

电源

5.25 V

温度等级

COMMERCIAL

速度

1.1 MHz

位元大小

8

Operating temperature range

-55...+125 °C

线圈型

112

处理器系列

6805

Shrinkage ratio

2 : 1

只读存储器可编程性

UVPROM

Operating voltage

600 V