Freescale Semiconductor MPC8245LZU266B

表面安装

YES

终端数量

352

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

BGA, BGA352,26X26,50

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA352,26X26,50

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B352

资历状况

不合格

电源

2,3.3 V

速度

266 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32