Freescale Semiconductor, Inc. (NXP Semiconductors) 54LS374/BSBJC

表面安装

YES

终端数量

20

Supply Voltage-Nom (Vsup)

5 V

Package Style

FLATPACK

Package Shape

RECTANGULAR

Package Equivalence Code

FL20,.3

Package Code

DFP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Risk Rank

5.92

Package Description

DFP, FL20,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

54LS374/BSBJC

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

FLAT

功能数量

8

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F20

资历状况

不合格

电源

5 V

温度等级

MILITARY

输出特性

3-STATE

逻辑IC类型

D FLIP-FLOP

筛选水平

38535Q/M;38534H;883B

触发器类型

积极优势