Freescale Semiconductor, Inc. (NXP Semiconductors) XPC860PCZP66D4

表面安装

YES

终端数量

357

EU RoHS

不合规

ECCN (US)

5A991

SVHC

有

SVHC Exceeds Threshold

有

Automotive

无

PPAP

无

Family Name

PowerQUICC MPC8xx Processor

Instruction Set Architecture

RISC

Number of CPU Cores

1

Data Bus Width (bit)

32

Instruction Cache Size

16KB

On-Chip Memory

8KB/RAM

Maximum Speed (MHz)

66

Interface Type

Ethernet/I2C/SPI/UART

UART

1

USART

0

Data Cache Size

8KB

Multiply Accumulate

无

I2C

1

I2S

0

Ethernet Interface Type

MII

Ethernet Speed

10Mbps/100Mbps

Minimum Operating Supply Voltage (V)

2|3.135

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

3.465|3.6

Maximum Power Dissipation (mW)

762

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Extended

Mounting

表面贴装

Package Height

1.35(Max)

Package Width

25

Package Length

25

PCB changed

357

Standard Package Name

BGA

Supplier Package

BGA

Lead Shape

Ball

Package Description

BGA, BGA357,19X19,50

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA357,19X19,50

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

3.135 V

Manufacturer Part Number

XPC860PCZP66D4

Clock Frequency-Max

66 MHz

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Motorola Mobility LLC

Part Life Cycle Code

Transferred

Ihs Manufacturer

MOTOROLA INC

Supply Voltage-Max

3.465 V

Risk Rank

5.17

Part Package Code

BGA

零件状态

Obsolete

ECCN 代码

3A001.A.3

HTS代码

8542.31.00.01

子类别

其他微处理器集成电路

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

357

JESD-30代码

S-PBGA-B357

资历状况

不合格

电源

3.3 V

速度

66 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32

座位高度-最大

2.05 mm

地址总线宽度

32

边界扫描

YES

低功率模式

YES

外部数据总线宽度

32

格式

固定点

集成缓存

YES

以太网

1

USB

0

SPI,SPI

1

CAN

0

设备核心

MPC8xx

宽度

25 mm

长度

25 mm