FT245RQ详情
FTDI FT245RQ重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
安装类型
表面贴装
表面安装
YES
终端数量
32
Dimensions
5 x 5 x 0.9mm
Minimum Operating Supply Voltage
1.8 V, 3.3 V, 4 V
Package Type
QFN
Maximum Operating Temperature
+85 °C
Minimum Operating Temperature
-40 °C
Maximum Operating Supply Voltage
5.25 V
Package Description
QCCN, LCC32,.2SQ,20
Package Style
CHIP CARRIER
Moisture Sensitivity Levels
3
Number of Words Code
384
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
LCC32,.2SQ,20
Operating Temperature-Min
-40 °C
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
FT245RQ
Clock Frequency-Max (fCLK)
12 MHz
Number of Words
384 words
Package Code
QCCN
Package Shape
SQUARE
Manufacturer
FTDI Chip
Part Life Cycle Code
活跃
Ihs Manufacturer
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
Risk Rank
2.32
子类别
FIFOs
端子位置
QUAD
终端形式
无铅
端子间距
0.5 mm
Reach合规守则
compliant
引脚数量
32
JESD-30代码
S-PQCC-N32
资历状况
不合格
电源
2/5,3.3/5.25 V
温度等级
INDUSTRIAL
配置
Single
操作模式
SYNCHRONOUS/ASYNCHRONOUS
时钟频率
12MHz
电源电流-最大值
0.0001 mA
组织结构
384X8
内存宽度
8
记忆密度
3072 bit
内存IC类型
BI-DIRECTIONAL FIFO
总线定向
Bi-Directional
宽度
5mm
高度
0.9mm
长度
5mm
FT245RQ拓展信息
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd
FTDI, Future Technology Devices International Ltd








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