FTDI Chip FT311D-32Q1C

表面安装

YES

Contact plating

gold-plated

Number of pins

22

终端数量

32

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD

Part Package Code

QFN

Package Description

HVQCCN, LCC32,.27SQ,25

Clock Frequency-Max

12 MHz

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

UNSPECIFIED

Package Code

HVQCCN

Package Equivalence Code

LCC32,.27SQ,25

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Max

1.98 V

Supply Voltage-Min

1.62 V

Supply Voltage-Nom

1.8 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x11

Row pitch

2.54mm

Gross weight

0.77 g

Operating temperature

-40...163°C

HTS代码

8542.31.00.01

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

端子间距

0.65 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

引脚数量

32

JESD-30代码

S-XQCC-N32

资历状况

不合格

温度等级

AUTOMOTIVE

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

0.9 mm

Rated voltage

60V

总线兼容性

I2C; SPI; USB; VBUS

最大数据传输率

0.425 MBps

个人资料

beryllium copper

长度

7 mm

宽度

7 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0