Fujitsu MB15E05SLPFV1

表面安装

YES

终端数量

16

Package Description

TSSOP, TSSOP16,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP16,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MB15E05SLPFV1

Supply Voltage-Nom (Vsup)

3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Spansion

Part Life Cycle Code

Transferred

Ihs Manufacturer

SPANSION INC

Risk Rank

5.19

HTS代码

8542.39.00.01

子类别

PLL或频率合成电路

技术

BICMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3 V

温度等级

INDUSTRIAL

模拟 IC - 其他类型

锁相环频率合成器