Fujitsu MB84SD23280FE-70PBS

表面安装

YES

终端数量

73

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA73,10X12,32

Operating Temperature-Min

-30 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Manufacturer Part Number

MB84SD23280FE-70PBS

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

赛普拉斯半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Risk Rank

5.69

子类别

其他存储器集成电路

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B73

资历状况

不合格

电源

1.8 V

温度等级

OTHER

内存IC类型

存储器电路

混合内存类型

FLASH+SRAM