Fujitsu MB84VD22293EE85PBS

表面安装

YES

终端数量

71

RoHS

Non-Compliant

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

2000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-25 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MB84VD22293EE-85PBS

Number of Words

2097152 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

FUJITSU Semiconductor Limited

Part Life Cycle Code

Transferred

Ihs Manufacturer

FUJITSU SEMICONDUCTOR AMERICA INC

Risk Rank

5.26

Part Package Code

BGA

无铅代码

无

附加功能

STATIC RAM IS ORGANIZED AS 512K X 16 OR 1M X 8; FLASH MEMORY IS ALSO ORGANIZED AS 4M X 8

HTS代码

8542.32.00.71

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

71

JESD-30代码

R-PBGA-B71

资历状况

不合格

电源电压-最大值(Vsup)

3.3 V

温度等级

OTHER

电源电压-最小值(Vsup)

2.7 V

操作模式

ASYNCHRONOUS

组织结构

2MX16

座位高度-最大

1.2 mm

内存宽度

16

记忆密度

33554432 bit

内存IC类型

存储器电路

宽度

7 mm

长度

12 mm