Fujitsu Electronics America, Inc. MB86831

表面安装

YES

终端数量

176

Package Description

QFP, QFP176,1.0SQ,20

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.89

Ihs Manufacturer

FUJITSU LTD

Part Life Cycle Code

Obsolete

Manufacturer

FUJITSU Limited

Package Shape

SQUARE

Package Code

QFP

Manufacturer Part Number

MB86831

Rohs Code

无

Operating Temperature-Max

70 °C

Package Equivalence Code

QFP176,1.0SQ,20

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G176

资历状况

不合格

电源

3.3,3.3/5 V

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32