General Electric IM5603AMFE/883B

表面安装

YES

终端数量

16

Package Description

DFP, FL16,.3

Package Style

FLATPACK

Number of Words Code

256

Package Body Material

CERAMIC

Package Equivalence Code

FL16,.3

Operating Temperature-Min

-55 °C

Access Time-Max

80 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

IM5603AMFE/883B

Number of Words

256 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

General Electric Solid State

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

OTP ROM

技术

TTL

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

电源

5 V

温度等级

MILITARY

电源电流-最大值

0.13 mA

组织结构

256X4

内存宽度

4

记忆密度

1024 bit

筛选水平

38535Q/M;38534H;883B

内存IC类型

OTP ROM