General Electric IM6551MDF/883C

表面安装

NO

终端数量

22

Package Style

IN-LINE

Part Life Cycle Code

Obsolete

Rohs Code

无

Supply Voltage-Nom (Vsup)

5 V

Usage Level

Military grade

Package Shape

RECTANGULAR

Package Equivalence Code

DIP22,.4

Package Description

DIP, DIP22,.4

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Number of Words Code

256

Number of Words

256 words

Manufacturer Part Number

IM6551MDF/883C

Manufacturer

General Electric Solid State

Access Time-Max

235 ns

Risk Rank

5.92

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T22

资历状况

不合格

电源

5 V

温度等级

MILITARY

操作模式

SYNCHRONOUS

电源电流-最大值

0.002 mA

组织结构

256X4

输出特性

3-STATE

内存宽度

4

待机电流-最大值

0.00001 A

记忆密度

1024 bit

筛选水平

MIL-STD-883 Class C

并行/串行

PARALLEL

内存IC类型

标准SRAM

待机电压-最小值

2 V