General Electric Solid State ICL8038BCJD

表面安装

NO

质量

0.4 kg

终端数量

14

Gross weight

416.00

Transport packaging size/quantity

28*25*20/50

Analogue

POS40

Execution

tube

Melting temperature

183...240 °C

Soldering temperature

285...330 °C

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Package Description

DIP, DIP14,.3

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

包装

coil

ECCN 代码

EAR99

类型

Soft solder tin-lead Sn/Pb with flux

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

温度等级

COMMERCIAL

模拟 IC - 其他类型

波形生成

直径

0.8 mm