GigaDevice GD25B64EWIGR
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GD25B64EWIGR详情
GigaDevice GD25B64EWIGR重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
包装/外壳
WSON-8
安装类型
表面贴装
供应商器件包装
8-WSON (5x6)
Interface Type
SPI
Supply Voltage-Min
2.7 V
Mounting Styles
SMD/SMT
Maximum Clock Frequency
133 MHz
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Factory Pack QuantityFactory Pack Quantity
3000
Package
Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
厂商
GigaDevice Semiconductor (HK) Limited
Product Status
活跃
Memory Types
Non-Volatile
Supply Voltage-Max
3.6 V
包装
Reel
操作温度
-40°C ~ 85°C (TA)
系列
-
技术
FLASH - NOR (SLC)
电压 - 供电
2.7V ~ 3.6V
内存大小
64 Mbit
速度
133 MHz
时钟频率
133 MHz
访问时间
7 ns
内存格式
FLASH
内存接口
SPI - Quad I/O
写入周期时间 - 字符、页面
70µs, 2.4ms
组织的记忆
8M x 8
GD25B64EWIGR拓展信息
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited








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