GigaDevice GD25LE128ESIGR
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GD25LE128ESIGR详情
GigaDevice GD25LE128ESIGR重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
包装/外壳
SOP-8
安装类型
表面贴装
供应商器件包装
8-SOP
Mounting Styles
SMD/SMT
Supply Voltage-Min
1.65 V
Active Read Current - Max
9 mA
Interface Type
SPI
Maximum Clock Frequency
133 MHz
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Factory Pack QuantityFactory Pack Quantity
2000
Package
Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
厂商
GigaDevice Semiconductor (HK) Limited
Product Status
活跃
Memory Types
Non-Volatile
Supply Voltage-Max
2 V
系列
GD25LE128E
包装
Reel
操作温度
-40°C ~ 85°C (TA)
技术
FLASH - NOR (SLC)
电压 - 供电
1.65V ~ 2V
内存大小
128 Mbit
速度
133 MHz
时钟频率
133 MHz
访问时间
6 ns
内存格式
FLASH
内存接口
SPI - Quad I/O, QPI
写入周期时间 - 字符、页面
60µs, 2.4ms
组织的记忆
16M x 8
GD25LE128ESIGR拓展信息
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited








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