GigaDevice GD25LQ16SIGR

表面安装

YES

终端数量

8

Stranding element

无

Permitted cable outer temperature after assembling without vibration

-40 - 90

Material core insulation

Polyvinyl chloride (PVC)

Colour outer sheath

Black

Outer diameter approx.

11.5

Screen over stranding element

None

Core identification

Numbers

Nominal cross section conductor

2.08

Screen over stranding

None

Low smoke (according to EN 61034-2)

无

Min. permitted bending radius, moving application/free movement

58

Nominal voltage U

1000

Material outer sheath

Polyvinyl chloride (PVC)

Conductor category

Class D = flexible

Package Description

SOP,

Package Style

小概要

Number of Words Code

16000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

GD25LQ16SIGR

Clock Frequency-Max (fCLK)

120 MHz

Number of Words

16777216 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

GigaDevice Semiconductor (Beijing) Inc

Part Life Cycle Code

接触制造商

Ihs Manufacturer

GIGADEVICE SEMICONDUCTOR INC

Risk Rank

5.75

类型

NOR型号

HTS代码

8542.32.00.51

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G8

温度等级

INDUSTRIAL

操作模式

SYNCHRONOUS

组织结构

16MX1

座位高度-最大

2.16 mm

内存宽度

1

记忆密度

16777216 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

1.8 V

电压 - 供电 （最大值）

2 V

电压 - 供电 （最小值）

1.65 V

宽度

5.23 mm

长度

5.28 mm