GigaDevice GD25LQ32EWIGR
- 收藏
- 对比
GD25LQ32EWIGR详情
GigaDevice GD25LQ32EWIGR重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
包装/外壳
WSON-8
安装类型
表面贴装
供应商器件包装
8-WSON (5x6)
Maximum Clock Frequency
133 MHz
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Moisture Sensitive
有
Factory Pack QuantityFactory Pack Quantity
3000
Interface Type
SPI
Active Read Current - Max
15 mA
Supply Voltage-Min
1.65 V
Mounting Styles
SMD/SMT
Package
Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
厂商
GigaDevice Semiconductor (HK) Limited
Product Status
活跃
Memory Types
Non-Volatile
Supply Voltage-Max
2 V
包装
切割胶带
操作温度
-40°C ~ 85°C (TA)
系列
-
技术
FLASH - NOR (SLC)
电压 - 供电
1.65V ~ 2V
内存大小
32 Mbit
速度
133 MHz
时钟频率
133 MHz
访问时间
6 ns
内存格式
FLASH
内存接口
SPI - Quad I/O, QPI
数据总线宽度
8 bit
组织结构
4 M x 8
写入周期时间 - 字符、页面
60µs, 2.4ms
组织的记忆
4M x 8
GD25LQ32EWIGR拓展信息
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited








哦! 它是空的。