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GigaDevice GD55LE511MEYIGY
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GD55LE511MEYIGY详情
GigaDevice GD55LE511MEYIGY重要参数规格及、参数值，及相似型号如下：
- 参数名参数值全选
- 参数名参数值全选
包装/外壳
WSON-8
Interface Type
SPI
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Factory Pack QuantityFactory Pack Quantity
4800
包装
Tray
GD55LE511MEYIGY拓展信息
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
GigaDevice Semiconductor (HK) Limited
公司资质
选择时请仔细核对商品参数信息
型号：GD25Q32CSIG
封装：8-SOIC (0.209, 5.30mm Width)
品牌：GigaDevice Semiconductor (HK) Limited
库存：9500
型号：GD25Q80CSIG
封装：8-SOIC (0.209, 5.30mm Width)
品牌：GigaDevice Semiconductor (HK) Limited
库存：19000
型号：GD25Q127CSIG
封装：8-SOIC (0.209, 5.30mm Width)
品牌：GigaDevice Semiconductor (HK) Limited
库存：0
型号：GD25Q64CWIGR
封装：8-WDFN Exposed Pad
品牌：GigaDevice Semiconductor (HK) Limited
库存：10
型号：GD25Q40CTIG
封装：8-SOIC (0.154, 3.90mm Width)
品牌：GigaDevice Semiconductor (HK) Limited
库存：20000
型号：GD25Q64CSIGR
封装：8-SOIC (0.209, 5.30mm Width)
品牌：GigaDevice Semiconductor (HK) Limited
库存：20
哦! 它是空的。