Globaltech Semiconductor Co Ltd GS5113SF

材料

aluminium

Transport packaging size/quantity

48*32*27/2000

Maximum current

19 A

Noal voltage

30 (AC/ DC) Vmin

Body diameter

11 mm

Mounting hole size

Ø8 mm

Mounting method

on the panel, soldering or banana plug

Type of heatsink

extruded

Heatsink shape

grilled

Colour

black

Material finishing

anodized

Mounting

for back plate

Plate thickness

11.5mm

Gross weight

700 g

Part Life Cycle Code

接触制造商

Ihs Manufacturer

GLOBALTECH SEMICONDUCTOR CO LTD

Package Description

,

ECCN 代码

EAR99

类型

panel mount binding post (F), Ø4 mm, isolator color - blue

HTS代码

8542.39.00.01

深度

49 mm

Reach合规守则

unknown

Insulation resistance

≥100 (at Udc=500 V) MOhm

Operating temperature range

-20…+80 °C

第二个连接器加载的位置数

universal

长度

0.2m

宽度

260mm

高度

67.5mm