HARRIS CD4072BK3

表面安装

YES

终端数量

14

Package Style

FLATPACK

Load Capacitance (CL)

50 pF

Package Body Material

CERAMIC

Package Equivalence Code

FL14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

CD4072BK3

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

Intersil Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTERSIL CORP

Risk Rank

5.91

Prop.

250 ns

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

not_compliant

JESD-30代码

R-XDFP-F14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

OR GATE

最大 I(ol)

0.00036 A

筛选水平

MIL-STD-883 Class B (Modified)

施密特触发器

NO