Harris ICM7170MDG/883C

表面安装

NO

终端数量

24

Manufacturer Part Number

ICM7170MDG/883C

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Package Description

DIP, DIP24,.6

Risk Rank

5.76

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP24,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

5 V

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5 V

温度等级

MILITARY

筛选水平

MIL-STD-883 Class C

时间-最小值

1/100 SECOND

中断能力

Y

易失性

YES

信息访问方法

PARALLEL