Harris Semiconductor CD4073BK

表面安装

YES

终端数量

14

Package Style

FLATPACK

Package Shape

RECTANGULAR

Package Equivalence Code

FL14,.3

Package Code

DFP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Load Capacitance (CL)

50 pF

Package Description

DFP, FL14,.3

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Part Life Cycle Code

Obsolete

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F14

资历状况

不合格

温度等级

MILITARY

逻辑IC类型

AND GATE

最大 I(ol)

0.00035999999999999997 A

Prop. Delay@Nom-Sup

250 ns

施密特触发器

NO