Harris Semiconductor HI1-5618B-2

表面安装

NO

终端数量

18

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Package Description

DIP, DIP18,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Settling Time-Nom (tstl)

0.065 µs

Supply Voltage-Nom

5 V

JESD-609代码

e0

ECCN 代码

3A001.A.2.C

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T18

资历状况

不合格

温度等级

MILITARY

比特数

8

转换器类型

D/A CONVERTER

线性度误差-最大值 (EL)

0.2441%

输入位代码

BINARY, OFFSET BINARY, 2''S COMPLEMENT BINARY

负供电电压

-15 V

输入格式

PARALLEL, 8 BITS

模拟输出电压-最大值

10 V

模拟输出电压-最小值

-10 V