Holtek Semiconductor Inc BS812C-1

Contact plating

gold-plated

表面安装

YES

Number of pins

70

终端数量

6

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x35

Row pitch

2.54mm

Gross weight

3.79 g

Part Life Cycle Code

活跃

Ihs Manufacturer

HOLTEK SEMICONDUCTOR INC

Package Description

LSSOP, TSOP6,.11,37

Date Of Intro

2019-10-25

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LSSOP

Package Equivalence Code

TSOP6,.11,37

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Supply Voltage-Nom (Vsup)

3 V

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

0.95 mm

Reach合规守则

compliant

Current rating

1.5A

JESD-30代码

R-PDSO-G6

电源电压-最大值(Vsup)

5.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.2 V

通道数量

1

模拟 IC - 其他类型

模拟电路

座位高度-最大

1.45 mm

Rated voltage

60V

个人资料

beryllium copper

长度

2.9 mm

宽度

1.6 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0