Hynix HYC0UEE0CF1P-6SH0E

表面安装

YES

终端数量

149

Manufacturer Part Number

HYC0UEE0CF1P-6SH0E

Part Life Cycle Code

活跃

Ihs Manufacturer

SK HYNIX INC

Package Description

FBGA-149

Risk Rank

5.66

Number of Words

16777216 words

Number of Words Code

16000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

附加功能

ITS ALSO CONTAINS 512M (64MX8BIT) NAND FLASH MEMORY

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B149

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

16MX16

座位高度-最大

1.4 mm

内存宽度

16

记忆密度

268435456 bit

内存IC类型

存储器电路

长度

14 mm

宽度

10 mm