IDT 72241L35J

表面安装

YES

终端数量

32

Package Style

CHIP CARRIER

Moisture Sensitivity Levels

1

Number of Words Code

4000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LDCC32,.5X.6

Reflow Temperature-Max (s)

6

Access Time-Max

20 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

72241L35J

Clock Frequency-Max (fCLK)

28.6 MHz

Number of Words

4096 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

QCCJ

Package Shape

RECTANGULAR

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.91

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn85Pb15)

HTS代码

8542.32.00.71

子类别

FIFOs

技术

CMOS

端子位置

QUAD

终端形式

J BEND

峰值回流焊温度（摄氏度）

260

端子间距

1.27 mm

Reach合规守则

not_compliant

JESD-30代码

R-PQCC-J32

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

操作模式

SYNCHRONOUS

组织结构

4KX9

内存宽度

9

记忆密度

36864 bit

内存IC类型

其他先进先出