IDT 72V15165L15TFI8

表面安装

YES

终端数量

64

Package Style

FLATPACK

Moisture Sensitivity Levels

3

Number of Words Code

4000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP64,.66SQ,32

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

6

Access Time-Max

10 ns

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

72V15165L15TFI8

Clock Frequency-Max (fCLK)

66.7 MHz

Number of Words

4096 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

QFP

Package Shape

SQUARE

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.92

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn85Pb15)

HTS代码

8542.32.00.71

子类别

FIFOs

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

操作模式

SYNCHRONOUS/ASYNCHRONOUS

电源电流-最大值

0.03 mA

组织结构

4KX16

内存宽度

16

待机电流-最大值

0.005 A

记忆密度

65536 bit

内存IC类型

其他先进先出

达到SVHC

not_compliant