IDT CA91C142B-33IE

表面安装

YES

终端数量

313

Package Description

35 X 35 MM, PLASTIC, BGA-313

Package Style

GRID ARRAY, INTERSTITIAL PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.5 V

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

CA91C142B-33IE

Clock Frequency-Max

33 MHz

Package Code

IBGA

Package Shape

SQUARE

Manufacturer

Tundra Semiconductor Corp

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TUNDRA SEMICONDUCTOR CORP

Supply Voltage-Max

5.5 V

Risk Rank

5.67

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B313

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, VME

座位高度-最大

3.5 mm

地址总线宽度

64

外部数据总线宽度

64

总线兼容性

PCI

最大数据传输率

70 MBps

宽度

35 mm

长度

35 mm