IDT CA91L8260B-100IE

表面安装

YES

终端数量

420

RoHS

有

Package Description

HBGA,

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

2.5 V

Supply Voltage-Min

2.38 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

CA91L8260B-100IE

Clock Frequency-Max

100 MHz

Package Code

HBGA

Package Shape

SQUARE

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Supply Voltage-Max

2.63 V

Risk Rank

5.48

Part Package Code

BGA

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

引脚数量

420

JESD-30代码

S-PBGA-B420

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, PCI

座位高度-最大

2.46 mm

地址总线宽度

32

外部数据总线宽度

64

总线兼容性

I2C; VGA; MPC826X; MPC825X; MPC827X; MPC8280; MPC74X; MPC75X; POWERPC 7400; POWERPC 7XX

驱动接口标准

IEEE 1394

宽度

35 mm

长度

35 mm

达到SVHC

compliant