Infineon 10565/BFBJC

表面安装

YES

终端数量

16

Package Description

DFP, FL16,.3

Package Style

FLATPACK

Package Body Material

CERAMIC

Package Equivalence Code

FL16,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

10565/BFBJC

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

算术电路

技术

ECL10K

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

电源

-5.2 V

温度等级

MILITARY

逻辑IC类型

ENCODER

筛选水平

38535Q/M;38534H;883B