Infineon BSM200GB170DL

表面安装

NO

终端数量

7

晶体管元件材料

SILICON

Package Description

FLANGE MOUNT, R-XUFM-X7

Package Style

FLANGE MOUNT

Package Body Material

UNSPECIFIED

Manufacturer Part Number

BSM200GB170DL

Package Shape

RECTANGULAR

Manufacturer

Eupec Gmbh & Co Kg

Number of Elements

2

Part Life Cycle Code

Obsolete

Ihs Manufacturer

EUPEC GMBH & CO KG

Risk Rank

5.71

端子位置

UPPER

终端形式

UNSPECIFIED

JESD-30代码

R-XUFM-X7

资历状况

不合格

配置

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

箱体转运

ISOLATED

极性/通道类型

N-CHANNEL

集电极电流-最大值(IC)

200 A

集电极-发射器电压-最大值

1700 V

达到SVHC

unknown