Infineon Technologies AG BCM20715A1KUBXG

表面安装

YES

材料

Galvanized steel

终端数量

42

Gross weight

0.42

Transport package size/quantity

28.5*21*19/2000

Thread

M3

Thread pitch

0.5

Mounting hole

4.22 +0.08 mm

Installation height

t = 0.98 mm

Inner diameter

d1 = 4.20 mm

Metal thickness

1.0 mm

Part Life Cycle Code

活跃

Ihs Manufacturer

INFINEON TECHNOLOGIES AG

Package Description

WLBGA-42

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom

1.22 V

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B42

温度等级

OTHER

座位高度-最大

0.6 mm

通信IC类型

电信电路

Outer diameter

d = 6.35 ±0.25 mm

高度

L = 1.5 ±0.25 mm

长度

3.019 mm

宽度

2.509 mm