Integrated Device Technology 71V3556S200PF

表面安装

YES

终端数量

100

Package Description

QFP, QFP100,.63X.87

Package Style

FLATPACK

Moisture Sensitivity Levels

3

Number of Words Code

128000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP100,.63X.87

Access Time-Max

3.2 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

71V3556S200PF

Clock Frequency-Max (fCLK)

200 MHz

Number of Words

131072 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

QFP

Package Shape

RECTANGULAR

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.91

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn85Pb15)

子类别

SRAMs

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

not_compliant

JESD-30代码

R-PQFP-G100

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

操作模式

SYNCHRONOUS

电源电流-最大值

0.4 mA

组织结构

128KX36

输出特性

3-STATE

内存宽度

36

待机电流-最大值

0.04 A

记忆密度

4718592 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

ZBT SRAM

待机电压-最小值

3.14 V