Integrated Device Technology IDT77V400S155DS

表面安装

YES

终端数量

208

Package Description

FQFP, QFP208,1.2SQ,20

Package Style

FLATPACK, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP208,1.2SQ,20

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

20

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

IDT77V400S155DS

Package Code

FQFP

Package Shape

SQUARE

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

8.79

Part Package Code

QFP

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

应用

ATM

HTS代码

8542.39.00.01

子类别

ATM/SONET/SDH ICs

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

225

功能数量

1

端子间距

0.5 mm

Reach合规守则

not_compliant

引脚数量

208

JESD-30代码

S-PQFP-G208

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

电源电流-最大值

0.16 mA

座位高度-最大

3.86 mm

通信IC类型

ATM/SONET/SDH SUPPORT CIRCUIT

宽度

28 mm

长度

28 mm