Integrated Silicon Solution, Inc. (ISSI) IS25WP064A-QHLA3

表面安装

YES

终端数量

24

Manufacturer Part Number

IS25WP064A-QHLA3

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Package Description

TBGA,

Risk Rank

5.67

Clock Frequency-Max (fCLK)

133 MHz

Number of Words

8388608 words

Number of Words Code

8000000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Supply Voltage-Nom (Vsup)

1.8 V

Usage Level

Automotive grade

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B24

电源电压-最大值(Vsup)

1.95 V

温度等级

AUTOMOTIVE

电源电压-最小值(Vsup)

1.65 V

操作模式

SYNCHRONOUS

组织结构

8MX8

座位高度-最大

1.2 mm

内存宽度

8

记忆密度

67108864 bit

筛选水平

AEC-Q100

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

1.8 V

长度

8 mm

宽度

6 mm