Integrated Silicon Solution, Inc. (ISSI) IS66WVH32M8BLL-100B1LI

表面安装

YES

终端数量

24

Manufacturer Part Number

IS66WVH32M8BLL-100B1LI

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Package Description

TBGA,

Risk Rank

5.74

Access Time-Max

40 ns

Number of Words

33554432 words

Number of Words Code

32000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Supply Voltage-Nom (Vsup)

3 V

HTS代码

8542.32.00.41

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B24

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

组织结构

32MX8

座位高度-最大

1.2 mm

内存宽度

8

记忆密度

268435456 bit

并行/串行

PARALLEL

内存IC类型

PSEUDO STATIC RAM

长度

8 mm

宽度

6 mm