Integrated Silicon Solution, Inc. (ISSI) IS67WVC4M16ECLL-7010BLA1

生命周期状态

Production (Last Updated: 2 years ago)

表面安装

YES

终端数量

54

Manufacturer Part Number

IS67WVC4M16ECLL-7010BLA1

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Package Description

6 X 8 MM, LEAD FREE, MO-207, VFBGA-54

Risk Rank

5.79

Access Time-Max

70 ns

Number of Words

4194304 words

Number of Words Code

4000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Reflow Temperature-Max (s)

未说明

ECCN 代码

3A991.B.2.A

HTS代码

8542.32.00.41

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.75 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B54

电源电压-最大值(Vsup)

1.95 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

4MX16

座位高度-最大

1 mm

内存宽度

16

记忆密度

67108864 bit

并行/串行

PARALLEL

内存IC类型

PSEUDO STATIC RAM

长度

8 mm

宽度

6 mm