Intel 82541EI

表面安装

YES

终端数量

196

RoHS

Non-Compliant

Package Description

BGA, BGA196,14X14,40

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA196,14X14,40

Operating Temperature-Max

55 °C

Manufacturer Part Number

82541EI

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Risk Rank

5.73

子类别

Serial IO/Communication Controllers

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B196

资历状况

不合格

电源

1.2,1.8,3.3 V

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, LAN