Intel AC82GL40SLGGM

表面安装

YES

终端数量

1329

Package Description

FBGA, BGA1329,48X48,28

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC

Package Equivalence Code

BGA1329,48X48,28

Manufacturer Part Number

AC82GL40/SLGGM

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.82

HTS代码

8542.31.00.01

子类别

内存控制器

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.7 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B1329

资历状况

不合格

电源

1.05,1.5,1.8,3.3 V