Intel AF82SM35-SLJ3Q

表面安装

YES

终端数量

493

RoHS

Non-Compliant

Shipping Restrictions

This product may require additional documentation to export from the United States.

Factory Pack QuantityFactory Pack Quantity

500

Part # Aliases

913605

Manufacturer

Intel

Brand

Intel

Tradename

SM35 Express

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA493,27X27,20

Rohs Code

有

Manufacturer Part Number

AF82SM35/SLJ3Q

Package Code

FBGA

Package Shape

SQUARE

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.84

系列

Whitney Point

包装

Reel

HTS代码

8542.31.00.01

子类别

Chipsets

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B493

资历状况

不合格

电源

1.8/3.3 V

产品类别

Chipsets

产品类别

Chipsets