Intel AGFB027R25A3I3E

包装/外壳

-

供应商器件包装

-

Rated current In

6

Material of contact surface

Gold

Type of fastening

Other

Pollution degree

2

Overvoltage category

III

Inflammability class of insulation material according to with UL94

V0

Rated surge voltage

2.5

Product Status

活跃

厂商

Intel

Package

Tray

Number of I/Os

624

系列

Agilex F

操作温度

-40°C ~ 100°C (TJ)

速度

1.4GHz

内存大小

256KB

核心处理器

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

周边设备

DMA, WDT

连接方式

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

建筑学

MPU, FPGA

主要属性

FPGA - 2.7M Logic Elements

闪光大小

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