Intel AT80573KH0366M/SLBAU

表面安装

YES

终端数量

771

Package Style

网格排列

Package Shape

RECTANGULAR

Package Equivalence Code

LGA771,30X33,46/43

Package Code

LGA

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.84

Package Description

LGA, LGA771,30X33,46/43

Ihs Manufacturer

INTEL CORP

Part Life Cycle Code

Obsolete

Rohs Code

有

Manufacturer Part Number

AT80573KH0366M/SLBAU

端子位置

BOTTOM

终端形式

无铅

端子间距

1.1 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-N771

资历状况

不合格

速度

1860 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

75000 mA

位元大小

64