Intel BX80532KC2000D/SL623

表面安装

NO

终端数量

603

Manufacturer Part Number

BX80532KC2000D/SL623

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

SPGA, PGA603,25X31,50

Risk Rank

5.92

Package Body Material

CERAMIC

Package Code

SPGA

Package Equivalence Code

PGA603,25X31,50

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, SHRINK PITCH

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XPGA-P603

资历状况

不合格

电源

1.4,3.3 V

速度

2000 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

45300 mA

位元大小

32